概述

Flexible Test and Scan Solution for FFC Devices. 32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for wafer-level chip scale and bare dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity. A complete finishing solution with full vision inspection, test contacting, with up to 12″ Wafer Input with 180° Flip-Chip under Turret.