FOWLP/FIWLP/eWLB compatible, high precision, high quality, fully automatic molding system
High precision platen parallelism by adopting 4-axis linear motion motor
Equipped with a high-pressure 85-ton press that enables MUF molding technology
Both liquid and granular resin can be supplied.
Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc.
SEMI S2 compliant, SEMI S8/CE optional
FOWLP: Fan-Out Wafer Level Package
FIWLP: Fan-In Wafer Level Package
EWLP: Embedded Wafer Level Package

Design, development, manufacture, sales and after services of semiconductor manufacturing equipment (molding equipment, automation equipment), dies and precision parts.

WCM-330

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