We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
Compact manual molding system. This system is the manual transfer molding system, designed for encapsulation of semiconductor device, versatile electronics devices, ECU for automobile etc. The system is recommended for the development work and small lot production.
0
檢驗、保險、評估、物流