The HRP-240 is an automated high-resolution surface metrology tool that provides long scan profilometry and high-resolution imaging for CMP and Etch applications. It has a new Dipping Mode™ capability for high aspect ratio depth monitoring and is reliable and easy to use for high-speed step height monitoring. It is the best solution for topographic metrology for wafer sizes up to 200 mm and can be configured as a basic profiler or a high-resolution, high aspect ratio instrument.

KLA inhabits two worlds: one that’s nanometers in scale and one that’s global. This micro and macro view gives us a unique perspective. We see electrons wave and industries transform. When you put deep science together with optimism, big things happen.

Our process-control and process-enabling solutions are designed to boost the innovation speed of the electronics industry. We help our customers achieve leading-edge performance.

HRP-240

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