FSM / FRONTIER SEMICONDUCTOR

FSM-128

8800

500TC

AQUAFLEX

900TC

Micro Raman system  for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling.  Fully automated C2C system.

RAMAN 360

Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.

413 C2C

Film stress and wafer bow measurement for wafers up to 300mm diameter. 2D/3D stress mapping standard. Semi-automated system with convenient wafer loading and retrieval.

FSM-128L

Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.

FSM / FRONTIER SEMICONDUCTOR

概述

活躍中的上架商品

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最熱門的 FSM / FRONTIER SEMICONDUCTOR Metrology

FSM-128

8800

500TC

FSM127

利用 Moov 將其上架並立即找到完美的買家。

所有 FSM / FRONTIER SEMICONDUCTOR Metrology