EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy. Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.

EVGroup (EVG)

EVG40 NT


The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.

ТВМ-8

EVG 20 IR Inspection System (stand-alone tool) Infrared Inspection Station (integrated module) 
The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes.  In addition, the infrared inspection system supports bond strength measurements using the Maszara method.

EVG20

EVG40

The EVG40 NT2 represents a major breakthrough in metrology performance to meet the new demands for the advanced packaging industry. It provides not only greater overlay accuracy but also a significant boost in throughput to enable higher measurement density per wafer, giving more detailed feedback on hybrid bonding performance, for example. This new metrology solution rounds out EVG’s comprehensive portfolio of process solutions for 3D/heterogeneous integration, and complements our existing EVG40 NT system, which remains the de facto bond metrology standard for MEMS and complex photonic devices. The EVG40 NT2 is already playing a key role in several joint development projects underway at EVG’s Heterogeneous Integration Competence Center™

EVG40 NT2

High-throughput, high-resolution metrology for bonded stacks and single wafers.
The EVG50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG's high-volume-manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool's application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.

EVGroup (EVG)

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EVG40 NT

ТВМ-8

EVG20

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