The LDS 3000 allows fully automatic defect monitoring in all process steps. All types of yield limiting visual defects on single layer or multi-layer patterned wafers will be detected, including thin film-, photo-, -etch- and the cleaning-process will be detected. Beside the micro the LDS 3000 can be equipped optionally also with fully automatic macro inspection.

KLA-Tencor Corporation announced that it has completed its acquisition of the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems. 
Vistec Semiconductor Systems - MIE provides advanced semiconductor mask and wafer manufacturing systems. 

On February of 2006, Leica Microsystems' Semiconductor Equipment Division has a new name: Vistec Semiconductor Systems. The name change is a result Golden Gate Capital takeover of Leica's semiconductor business.

LDS3000

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