The EVG610 is a versatile lithography system that supports various standard processes including vacuum, hard, soft, and proximity exposure modes, with an added feature of back-side alignment. It also provides extra capabilities such as bond alignment and nanoimprint lithography (NIL). The system is designed for quick processing and easy reconfiguration to meet changing requirements, boasting a conversion time of just a few minutes. Its user-friendly design caters to all skill levels, from beginners to experts, making it an excellent choice for universities and R&D applications.

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVG610

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