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VEECO / ULTRATECH AP300
    描述
    possible exposure to Gold
    配置
    2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental Chamber
    OEM 代工型號說明
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
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    VEECO / ULTRATECH

    AP300

    verified-listing-icon

    已驗證

    類別

    Lithography
    上次驗證: 超過60天前
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    18575


    晶圓尺寸:

    12"/300mm


    年份:

    2006

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    類似上架商品
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    VEECO / ULTRATECH AP300
    VEECO / ULTRATECHAP300Lithography
    年份: 2009條件: 二手
    上次驗證超過30天前

    VEECO / ULTRATECH

    AP300

    verified-listing-icon

    已驗證

    類別

    Lithography
    上次驗證: 超過60天前
    listing-photo-LCWuc-QwlG7NfIwNpjBkDi_ftOKr3_wFhBMejP_Onso-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    18575


    晶圓尺寸:

    12"/300mm


    年份:

    2006


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    possible exposure to Gold
    配置
    2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental Chamber
    OEM 代工型號說明
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
    文檔

    無文檔

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