描述
possible exposure to Gold配置
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM 代工型號說明
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.文檔
無文檔
VEECO / ULTRATECH
AP300
已驗證
類別
Lithography
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
18575
晶圓尺寸:
12"/300mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部VEECO / ULTRATECH
AP300
已驗證
類別
Lithography
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
18575
晶圓尺寸:
12"/300mm
年份:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
possible exposure to Gold配置
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM 代工型號說明
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.文檔
無文檔