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JetStep W2300

概述

The JetStep W Series is designed for wafers and other round substrates. The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge. With specialized large field optics and key system advantages, the system delivers maximum throughput without limiting resolution and overlay.

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