概述

The EVG750 roll-to-roll hot-embossing system is designed for R&D as well as pilot manufacturing of all-in-plastic flexible substrates for applications ranging from anti-counterfeiting, surface texturing (photovoltaics, displays, sensors) to biofunctional constructs. The system combines an automated foil handling unit for unwinding and rewinding with the core embossing module and accepts 300 mm wide films with thicknesses ranging from 50 µm to 1000 µm. In addition, the EVG750 roll-to-roll hot-embossing system has the ability to handle exotic films which are not available on large rolls and automatically detects the splicing film line through an optical sensor and adjusts the position of the structuring cylinder via encoders to the tape position.