描述
Laser Saw配置
無配置OEM 代工型號說明
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.文檔
無文檔
ASMPT
LASER1205
已驗證
類別
Laser
上次驗證: 24 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113834
晶圓尺寸:
6"/150mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT
LASER1205
類別
Laser
上次驗證: 24 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113834
晶圓尺寸:
6"/150mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Laser Saw配置
無配置OEM 代工型號說明
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.文檔
無文檔