概述

The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.