概述

The DualBeam 865 is a FIB/SEM system with 3DCD automation designed to provide thin film head manufacturers with fast, precise, automatic, three-dimensional CD (critical dimension) measurements. The system is capable of measuring multi-layer three-dimensional structures that are difficult or impossible to see with conventional, single-layer, top-down techniques. It automatically ion-mills a cross section, acquires a high-resolution SEM image of the exposed face, and measures cross-sectional CDs to provide fast, precise control of the head manufacturing process. The DualBeam 865 integrates high-performance subsystems such as the Magnum ion column and the dual-mode Hexalens electron column for faster milling and high-resolution SEM imaging. Advanced 3DCD automation permits unattended operation for increased operator productivity and the system is fully compliant with the fab environment and multi-vendor yield management data systems.