The GSD/HE is a high-energy implant device that is designed to maximize productivity and flexibility in a wide range of implant applications, including 200mm high energy implantation for logic and memory chips. With an energy range from 10keV to over 3MeV, it can perform all retrograde wells and channel implants in a chain. The device features exceptional beam purity, thanks to its patented linear acceleration technology, and is built on a production-proven GSD wafer-handling architecture. It is also easy to access and maintain, which helps to increase productivity and reduce the cost of ownership. Additionally, the GSD/HE can be used as a backup for medium current implantation, further increasing ROI.

Designs, manufactures and services ion implantation and other processing equipment used in the fabrication of semiconductor chips.

AXCELIS

GSD HE

The SEN CORPORATION / SUMITOMO NV-GSD HE3 is an ion implanter that uses high-energy and was developed by SEN Corporation. It is an improved version of the NV-GSD-HE3, with the addition of six RF resonators to the beam line. The system is configured for 300mm wafers and can accelerate boron ions up to 2 MeV with a beam current of 0.75 mA, as well as phosphorus ions up to 4.4 MeV with a beam current of 0.35 mA. Its primary use is in the image sensor market, where it increases the depth of CCD photodiodes in the wafer surface, allowing for higher pixel density in image sensors. The system also features a state-of-the-art beam profile controller for optimizing implant damage and micro-uniformity. 

In 2000, Eaton spun off Axcelis as a separate company, and Axcelis inherited Eaton’s 50-percent ownership stake in the joint venture. SEN, licenses technology from Axcelis for ion implantation, has exclusive rights to the territory of Japan and is the leading producer of ion implantation equipment in Japan. In 2009, the merger between Axcelis Technologies and Sumitomo Heavy Industries dissolved—Sumitomo became the sole parent company, and with this, the company name changed to SEN Corporation. 

SEN CORPORATION / SUMITOMO

NV GSD HE3

NV GSD

Sure! Here’s the updated statement: “The Varian xR200S, part of the xRS Series implanters, offers higher throughput and lower cost of ownership due to enhancements such as a low inertia process wheel and faster spin motor. This results in a processing speed of 235 wafers per hour for 200mm wafers and 220 wafers per hour for 300mm wafers. Additionally, the xR200S provides maximum flexibility by offering the largest energy range available, up to 720keV with the high-energy option.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

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GSD HE

NV GSD HE3

NV GSD

xR200S