描述
Tool is still running production.配置
Gas Configuration Gas Type BF3 : SDS PH3 : SDS AsH3 : SDS External Facilities Connections : Ar | N2 Loading Configuration: SMIF Electrical Requirements : 208V / 250A GEM/SECS Interface : Yes SECS II Interface : Yes Energy Range : 80KeV Through Wafer – Wafer on Blade Sensor : Yes Hollow Gripper : Yes PEEK Moving Clips : Yes Ion Source Type : Bernas Plasma Flood System : Standard Source Material Type : Tungsten Arc Chamber Front Plate : Split Graphite Dual Vaporizers : No Post-Acceleration Tube/Turbo Pump : Leybold Process Chamber/Cryopumps : CTI OB10OEM 代工型號說明
The Precision Implant xR80 was introduced in October 1995. It features low-energy and a very small system footprint while maintaining high throughput.文檔
無文檔
APPLIED MATERIALS (AMAT)
xR80
已驗證
類別
High Current
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
16512
晶圓尺寸:
未知
年份:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
xR80
已驗證
類別
High Current
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
16512
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Tool is still running production.配置
Gas Configuration Gas Type BF3 : SDS PH3 : SDS AsH3 : SDS External Facilities Connections : Ar | N2 Loading Configuration: SMIF Electrical Requirements : 208V / 250A GEM/SECS Interface : Yes SECS II Interface : Yes Energy Range : 80KeV Through Wafer – Wafer on Blade Sensor : Yes Hollow Gripper : Yes PEEK Moving Clips : Yes Ion Source Type : Bernas Plasma Flood System : Standard Source Material Type : Tungsten Arc Chamber Front Plate : Split Graphite Dual Vaporizers : No Post-Acceleration Tube/Turbo Pump : Leybold Process Chamber/Cryopumps : CTI OB10OEM 代工型號說明
The Precision Implant xR80 was introduced in October 1995. It features low-energy and a very small system footprint while maintaining high throughput.文檔
無文檔