描述
無描述配置
無配置OEM 代工型號說明
The AVP-8000 is a vertical batch furnace with a flexible platform for diffusion, oxidation, and LPCVD processes. It is a previous version of the AVP Ace and can handle 150-200mm wafers. Some features of the AVP-8000 include a small footprint that enables side by side installation, low cost of ownership, single or dual boat configuration, and the ability to handle up to 200 wafer batches. It also has flexible substrate handling for 150mm and/or 200mm wafers, including perforated and thin/bowed wafers. Some of its applications include wet/dry thermal oxide, radical oxidation, silicon nitride (stoichiometric and low stress), TEOS, SiH4 and DCS-based SiO2, doped (P, As, B) and un-doped polysilicon, atomic layer deposition, and anneal and cure from 100 to >1200°C.文檔
無文檔
類別
Furnaces / Diffusion
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
145535
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
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AVIZA / SVG / THERMCO
AVP 8000
類別
Furnaces / Diffusion
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
145535
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The AVP-8000 is a vertical batch furnace with a flexible platform for diffusion, oxidation, and LPCVD processes. It is a previous version of the AVP Ace and can handle 150-200mm wafers. Some features of the AVP-8000 include a small footprint that enables side by side installation, low cost of ownership, single or dual boat configuration, and the ability to handle up to 200 wafer batches. It also has flexible substrate handling for 150mm and/or 200mm wafers, including perforated and thin/bowed wafers. Some of its applications include wet/dry thermal oxide, radical oxidation, silicon nitride (stoichiometric and low stress), TEOS, SiH4 and DCS-based SiO2, doped (P, As, B) and un-doped polysilicon, atomic layer deposition, and anneal and cure from 100 to >1200°C.文檔
無文檔