概述

XD248 Precision Component Handling System – designed for versatility and efficiency in semiconductor manufacturing. With a throughput of 36,000 UPH, it handles QFN/MLP, SOIC, SOT23, SC70, SOT89, and SOT223 packages (1.0x0.6mm to 12x12mm). Featuring up to 8 test sites and optional advanced vision systems for rigorous testing and seamless transitions to Tape and Reel output. Elevate your production line with XD248's precision and efficiency.