Oxide etcher.
Process performance:
Specialized for critical etch process (DRAM, V-NAND and Logic).
Clean process / low Particle.
High etch rate / high mask selectivity.
Precise CD and CD uniformity control.
Vertical profile control and low micro-loading effect.

Productivity / Hardware:
Cluster transfer module : Max. 6 chambers.
Layout for easy maintenance.
RF sync pulse function for HARC etch.
Radial uniformity control HW : gas, temperature.
Precise & reliable process parameter control.
Low CoO / Long MTBC.

Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

MICHELAN O2

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