Poly etcher.
Process performance:
Specialized for critical etch process (DRAM, V-NAND and Logic).
Fast etch / various control knobs for uniform etch rate.
High mask selectivity / high accuracy of CD control.
Low Particle / Vertical Etching.
Productivity / Hardware:
Cluster and quadra type transfer module : Max. 6 chambers.
ICP type etcher : high plasma density.
Exclusive ICP Source Antenna.
RF sync pulse function : high aspect ratio.
Multi-zone ESC heating and 3Z-tunable gas radial uniformity control.
Low cost and extended MTBC.

Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

MICHELAN C3

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