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描述
無描述配置
Advanced Silicon Etcher (ASE) Version 2 Deep High-Aspect Ration Etcher (DRIE) Silicon etcher Load-lock and chucks for 100mm and 150mm Electrostatic clamping chuck upgrade for SOI wafers and the Xenon Difluoride (XeF) module for isotropic etching.OEM 代工型號說明
Deep Reactive Ion Etching (DRIE)文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
97582
晶圓尺寸:
4"/100mm, 6"/150mm
年份:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
STS
MESC MULTIPLEX ICP
類別
Dry / Plasma Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
97582
晶圓尺寸:
4"/100mm, 6"/150mm
年份:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Advanced Silicon Etcher (ASE) Version 2 Deep High-Aspect Ration Etcher (DRIE) Silicon etcher Load-lock and chucks for 100mm and 150mm Electrostatic clamping chuck upgrade for SOI wafers and the Xenon Difluoride (XeF) module for isotropic etching.OEM 代工型號說明
Deep Reactive Ion Etching (DRIE)文檔
無文檔