描述
無描述配置
Cu Process SMIF Loaders - 300mmOEM 代工型號說明
The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.文檔
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD-312
已驗證
類別
Electro Plating
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
57814
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD-312
已驗證
類別
Electro Plating
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
57814
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Cu Process SMIF Loaders - 300mmOEM 代工型號說明
The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.文檔
無文檔