描述
CU PLATING配置
CU PLATINGOEM 代工型號說明
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.文檔
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APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
已驗證
類別
PVD / Sputtering
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56163
晶圓尺寸:
12"/300mm
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
已驗證
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56163
晶圓尺寸:
12"/300mm
年份:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
CU PLATING配置
CU PLATINGOEM 代工型號說明
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.文檔
無文檔