The LT210c is an advanced electrochemical deposition tool that delivers high throughput in a small footprint. It uses patented Capsule™ technology for superior copper fill and integrated removal of backside and bevel copper contamination. The tool is fully automated and can fill features as small as 0.08µm with superior purity and uniformity. It has a small footprint and offers fast installation, low cost of ownership, and high reliability. The LT210c can be used for a variety of applications including Copper Damascene, Nickel ECD, Solder ECD, Gold ECD, Platinum ECD, Copper Anneal, Tantalum Anodization (High-K), Patterned Copper, Gold ElectroEtch, ECD Seed Layer, and Thin Film Heads.

Designed, developed & manufactured high performance and precision chemical processing equipment. Products included electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems.

SEMITOOL

LT-210c

The Applied Raider GT ECD for electroplating advanced chip interconnect structures. Raider GT ECD is a copper plating tool and is a 300 mm wafer processor. The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. A multi-zone anode array enables electroplating on ultra-thin and resistive seed layers.


Semitool is supplies electrochemical plating and wafer surface preparation equipment used by chip packaging and chip making companies around the world.

APPLIED MATERIALS (AMAT) / SEMITOOL

RAIDER GT ECD

ACMS XT II

SABRE Excel, an electroplating system designed to provide industry-leading fill and defect density performance for the 22 nanometer technology node and beyond. The SABRE Excel platform features a new deposition module incorporating our patented IRISCell™ technology, as well as new hardware, software, and communications upgrades to the process tool’s mainframe required to address advanced fill applications.

Lam Research is a leading supplier of plasma etch- and single-wafer clean equipment that plays a pivotal role in defining the features and capabilities of next-generation semiconductor devices. With the addition of Novellus' innovative thin-film deposition and surface preparation product lines, the new Lam Research is well-positioned within the industry to support critical technology transitions including 3D structures in advanced logic and NAND memory, as well as the scaling to 450 mm wafers.

Electro Cu Platers

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Electro Cu Platers 的製造商

Electro Cu Platers 最熱門的產品

LT-210c

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RAIDER GT ECD

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ACMS XT II

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SABRE EXCEL

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