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TEL / TOKYO ELECTRON TELIUS SP 305 SCCM
    描述
    Dielectric Etch
    配置
    <p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>
    OEM 代工型號說明
    Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.
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    TEL / TOKYO ELECTRON

    TELIUS SP 305 SCCM

    verified-listing-icon

    已驗證

    類別
    Dry / Plasma Etch

    上次驗證: 19 天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    20225


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    TEL / TOKYO ELECTRON TELIUS SP 305 SCCM

    TEL / TOKYO ELECTRON

    TELIUS SP 305 SCCM

    Dry / Plasma Etch
    年份: 2008條件: 二手
    上次驗證超過60天前

    TEL / TOKYO ELECTRON

    TELIUS SP 305 SCCM

    verified-listing-icon
    已驗證
    類別
    Dry / Plasma Etch
    上次驗證: 19 天前
    listing-photo-px0mqP9OKO_mroLBpmNjJvIvTR_H_KxFtLTuJqdOWEw-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    20225


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Dielectric Etch
    配置
    <p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">         ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>
    OEM 代工型號說明
    Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.
    文檔

    無文檔

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