跳到主要內容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情

Moov logo

Moov Icon
LAM RESEARCH CORPORATION 2300 VERSYS KIYO
  • LAM RESEARCH CORPORATION 2300 VERSYS KIYO
  • LAM RESEARCH CORPORATION 2300 VERSYS KIYO
  • LAM RESEARCH CORPORATION 2300 VERSYS KIYO
描述
Polysilicon Etch
配置
2300e4 KIYO EX
OEM 代工型號說明
The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.
文檔

無文檔

類別
Dry / Plasma Etch

上次驗證: 14 天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

62711


晶圓尺寸:

12"/300mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH CORPORATION

2300 VERSYS KIYO

verified-listing-icon
已驗證
類別
Dry / Plasma Etch
上次驗證: 14 天前
listing-photo-5c9671e41acc4a0bafc4dfc6822d787f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

62711


晶圓尺寸:

12"/300mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Polysilicon Etch
配置
2300e4 KIYO EX
OEM 代工型號說明
The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.
文檔

無文檔