描述
無描述配置
Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2OEM 代工型號說明
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ULVAC
NE-950EX
已驗證
類別
Dry Etch
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
24162
晶圓尺寸:
6"/150mm
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULVAC
NE-950EX
已驗證
類別
Dry Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
24162
晶圓尺寸:
6"/150mm
年份:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2OEM 代工型號說明
未提供文檔
無文檔