BESTEM‐S500
概述
Wafer Size: 6/8/12 inch This machine picks up only quality die from diced wafers, A die sorter that is aligned and stored in the tray.
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Wafer Size: 6/8/12 inch This machine picks up only quality die from diced wafers, A die sorter that is aligned and stored in the tray.
0
檢驗、保險、評估、物流