This machine picks up only quality die from diced wafers, organizes and stores them on the tray. Equipped with full digital control bonding head with high-speed potential, records location data for each unit based on work data, various teaching functions and HMI bonding facilitate high productivity, ease of adjustment, stability and flexibility.

CANON acquired NEC Machinery and became CANON Machinery which focuses on: Die bonders, die sorters, inspection equipment, mounters, cure furnaces on the semiconductor side of the business.


BESTEM-S300

類別

概述

活躍中的上架商品

服務

最熱門的上架商品

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