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BESI / DATACON 2200 APM
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.
    文檔

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    類別
    Die Bonders / Sorters / Attachers

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    61594


    晶圓尺寸:

    未知


    年份:

    2006


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    BESI / DATACON

    2200 APM

    verified-listing-icon
    已驗證
    類別
    Die Bonders / Sorters / Attachers
    上次驗證: 超過60天前
    listing-photo-25f5e852f1d24b479b4cbe0a8f2f7802-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/25f5e852f1d24b479b4cbe0a8f2f7802/1a87284f9b9b43bc8ac93c9da68521a6_c551089f964c45a6836fcce5a46a9ea41201a_mw.jpeg
    listing-photo-25f5e852f1d24b479b4cbe0a8f2f7802-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/25f5e852f1d24b479b4cbe0a8f2f7802/c505341eae3e45968865d43ef81dc209_614eb4946e5842198722c70d5aaa53181201a_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    61594


    晶圓尺寸:

    未知


    年份:

    2006


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.
    文檔

    無文檔

    類似上架商品
    查看全部