IS868LA2
類別
Bonders概述
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
活躍中的上架商品
5
服務
檢驗、保險、評估、物流
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
5
檢驗、保險、評估、物流