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ASM AD898
    描述
    Die Bond
    配置
    working
    OEM 代工型號說明
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
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    ASM

    AD898

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    已驗證

    類別

    Die Sorters & Attachers
    上次驗證: 超過60天前
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    50689


    晶圓尺寸:

    未知


    年份:

    2003

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    Logistics Support
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    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
    Available
    類似上架商品
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    ASM AD898
    ASMAD898Die Sorters & Attachers
    年份: 0條件: 二手
    上次驗證23 天前

    ASM

    AD898

    verified-listing-icon

    已驗證

    類別

    Die Sorters & Attachers
    上次驗證: 超過60天前
    listing-photo-ecb7002fdb0f4543b8ebedbbec306964-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    50689


    晶圓尺寸:

    未知


    年份:

    2003


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Die Bond
    配置
    working
    OEM 代工型號說明
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
    文檔

    無文檔

    類似上架商品
    查看全部
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    Die Sorters & Attachers年份: 0條件: 二手上次驗證: 超過60天前
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachers年份: 0條件: 二手上次驗證: 超過60天前