描述
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.配置
無配置OEM 代工型號說明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.文檔
無文檔
ASM
AD898
已驗證
類別
Die Sorters & Attachers
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13138
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
AD898
已驗證
類別
Die Sorters & Attachers
上次驗證: 8 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13138
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.配置
無配置OEM 代工型號說明
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.文檔
無文檔