描述
standard 12" wafe flip chip bonder configuration, conditional very good配置
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEM 代工型號說明
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.文檔
無文檔
ASM
AD8312FC
已驗證
類別
Die Sorters & Attachers
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59681
晶圓尺寸:
12"/300mm
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
AD8312FC
已驗證
類別
Die Sorters & Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59681
晶圓尺寸:
12"/300mm
年份:
2017
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
standard 12" wafe flip chip bonder configuration, conditional very good配置
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEM 代工型號說明
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.文檔
無文檔