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ASM AD8312FC
    描述
    Die bonder
    配置
    無配置
    OEM 代工型號說明
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
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    verified-listing-icon

    已驗證

    類別
    Die Bonders / Sorters / Attachers

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    65365


    晶圓尺寸:

    未知


    年份:

    2015


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    ASM

    AD8312FC

    verified-listing-icon
    已驗證
    類別
    Die Bonders / Sorters / Attachers
    上次驗證: 超過60天前
    listing-photo-17b43be5ff3a4c16886605b01a1b7d4b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50884/17b43be5ff3a4c16886605b01a1b7d4b/27506a84d3474737bab1f11b32edad9c_9eb456ca99ff4fe78a4eb5fbc74a14091201a_mw.jpeg
    listing-photo-17b43be5ff3a4c16886605b01a1b7d4b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50884/17b43be5ff3a4c16886605b01a1b7d4b/35cc4b9efac54d9194977e011b0fe196_81dfadb70932416ca86299bffc6d61001201a_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    65365


    晶圓尺寸:

    未知


    年份:

    2015


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Die bonder
    配置
    無配置
    OEM 代工型號說明
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
    文檔

    無文檔