Esec 2100 sD has a Device Height Sensor, High Precision Bond Head, High Resolution Vision Systems, which now also includes an Up Looking System while the Dual Dispensing Module brings productivity to high speed applications. The Dispense Volume Control and the Low Contrast Kit bring Process Control.

Die Bonder

BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

2100 sD

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