概述

The Datacon 8800 TC is a bonding equipment that utilizes Thermo Compression (TC) technology, which is a crucial technology for current 2.5D/3D chip-to-substrate (C2S) and chip-to-wafer (C2W) packaging applications. Thermo Compression with CUF (Chip-to-Uneven-Flag) is a well-established process used in 3D memory applications. Die Bonder