概述

The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak.