BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

Member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI. The Esec 2100 sD advanced Die bonder is able to handle the most challenging thin die and warped strip packages. the proven "light & rigid" structure of the pick and place ensures highest accuracy and maximized throughput.

Die Bonder

BESI / ESEC

2100 sD advanced

Die Bonders / Sorters / Attachers

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2100 sD advanced

Die Bonders / Sorters / Attachers

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