描述
無描述配置
無配置OEM 代工型號說明
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.文檔
無文檔
BESI / ESEC
2100 xP
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
27595
晶圓尺寸:
未知
年份:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
27595
晶圓尺寸:
未知
年份:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.文檔
無文檔