Automatic, High Accuracy Die Attach System

MICROASSEMBLY

MAT 6400

The Alphasem Easyline 8033 clip-attach system is the answer for high-speed clip-attach applications for power devices such as SOD, SMA, DPAK, TO 220, etc. The clip-attach process replaces the wire connection between die and the leads with a solid copper bridge where no wire bonder is longer needed.

K&S acquired Alphasem. Alphasem is a leading supplier of die bonder equipment and MEMS packaging equipment. 


6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

Die Attachers/Bonders

概述

服務

Die Attachers/Bonders 的製造商

Die Attachers/Bonders 最熱門的產品

MAT 6400

EASYLINE 8033