概述

The NSX-70 is an automated micro defect inspection system introduced in 1998 as part of the NSX series. It delivers high-speed, consistent, and reliable defect detection to semiconductor and microelectronic manufacturers. The system assesses the quality of products at several steps in the manufacturing process and feeds critical information about process integrity to yield management or factory automation systems. This data allows for enhanced process control and improved yields. The NSX series is driven by advanced proprietary software and includes integrated yield enhancement tools such as automated data collection and reporting, extensive communication options, and fast, easy setup using Windows®-based menus. Customers can tailor the system towards their specific application, process, or budget by choosing from a range of capabilities including application-specific software, material handling abilities, selectable defect resolution, capability to inspect components made from materials other than silicon, ability to inspect samples ranging from individual integrated circuits to next-generation 300mm wafers, and communications and network options.