概述

In 2001, we introduced the 2430 macro ADI series, which brought the benefits of the 2401's advanced analysis capabilities, high throughput and advanced detection algorithms to 300 mm production. Macro defects, which can ruin the entire wafer, are especially costly to chipmakers in 300 mm production, since more than twice the number of die are at risk with these larger wafers as compared to 200 mm wafers. The 2430 is the first automated macro ADI system on the market to be fully compliant with I300I standards for complete integration and rapid deployment in 300 mm fabs. Backside Wafer Inspection