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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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KLA AIT I
  • KLA AIT I
  • KLA AIT I
  • KLA AIT I
描述
無描述
配置
Patterned Wafer Inspection
OEM 代工型號說明
The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.
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KLA

AIT I

verified-listing-icon

已驗證

類別
Defect Inspection

上次驗證: 超過30天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

116925


晶圓尺寸:

6"/150mm, 8"/200mm


年份:

1997


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

AIT I

verified-listing-icon
已驗證
類別
Defect Inspection
上次驗證: 超過30天前
listing-photo-8a675a86c44042ad838d0eeb1c5dd5cf-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

116925


晶圓尺寸:

6"/150mm, 8"/200mm


年份:

1997


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
Patterned Wafer Inspection
OEM 代工型號說明
The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.
文檔

無文檔