跳到主要內容
Moov logo

Moov Icon

CI-T120S

概述

The ICOS CI-T120S and ICOS CI-T130S systems offer 2D and 3D metrology and inspection for Flip-Chip packaging, combining bump inspection, substrate top and bottom surface inspection and substrate warpage inspection in one system.

活躍中的上架商品

0

服務

檢驗、保險、評估、物流

最熱門的上架商品

    未找到產品
有類似商品?
利用 Moov 將其上架並立即找到完美的買家。