概述

The UVision® 7 system is a member of the successful UVision wafer inspection product family, featuring core technology of DUV laser illumination, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line. The system boasts the industry’s smallest optical inspection pixel size (30nm), which enables cutting-edge R&D activities with sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include FinFET logic devices, DRAM, 4x 3D NAND, double and quadruple patterning, and EUV layers. The UVision 7 system is designed for 30% greater light intake compared to the previous-generation tool, pushing the wafer laser power operating limits even further and significantly enhancing sensitivity. The platform also features an enhanced collection system that improves sensitivity in both dense logic and edge-of-array areas, reducing the false alarm rate in these areas by up to 50%. Furthermore, with its more than 40% higher throughput, the tool improves cost of ownership for manufacturing applications. The UVision 7 system incorporates Marker™, a new integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics to customize detection thresholds to local geometries and noise. This capability enhances sensitivity, improves binning, and tightens coordinate accuracy. The Marker application is a key component in the new system’s value added for process development and manufacturing activities. UVision 7 is field-upgradable from UVision 6, making its enhanced capabilities readily accessible to customers.