概述

The 88 series uses an enhanced in-line robotic transfer arm between each module which makes critical transfers, such as between soft bake and chill, much more easily controlled compared to a totally random robotic system. The 88 Series is ideal for submicron manufacturing and is capable of processing 3″ through 150 mm substrates including Silicon, GaAs, Sapphire, GGG, Lithium Niobate, thin film heads, MEMS and many other substrate types.