描述
wet cleaning of debonded thin wafer on tape-frame / carrier wafer配置
無配置OEM 代工型號說明
SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.文檔
無文檔
類別
Coaters & Developers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
103670
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
SD12
類別
Coaters & Developers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
103670
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
wet cleaning of debonded thin wafer on tape-frame / carrier wafer配置
無配置OEM 代工型號說明
SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.文檔
無文檔