概述

The XCEDA copper CMP system is an advanced 300-mm platform designed to exceed both the technical and economic requirements of CMP at 65 nm and beyond. The XCEDA’s four polishing modules and through-the-pad slurry delivery system can reduce slurry usage by up to 40%, dramatically reducing cost-of-ownership. The XCEDA system has also demonstrated quality planarization results on porous ultra low-k (ULK) materials with k-values of less than 2.0.