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DISCO DFP8141
  • DISCO DFP8141
  • DISCO DFP8141
  • DISCO DFP8141
描述
無描述
配置
無配置
OEM 代工型號說明
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
文檔

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verified-listing-icon

已驗證

類別
CMP

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

112290


晶圓尺寸:

未知


年份:

2023


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

DISCO

DFP8141

verified-listing-icon
已驗證
類別
CMP
上次驗證: 超過60天前
listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/49212bf109974ae3938bc87dbf291a06_screenshot20240902at3_mw.png
listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/a0090fd10e924898a34c080944707abd_screenshot20240902at3_mw.png
listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/4d8f40506fd943bc83df46cbd8262bd4_screenshot20240902at3_mw.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

112290


晶圓尺寸:

未知


年份:

2023


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
無配置
OEM 代工型號說明
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
文檔

無文檔